التفاصيل البيبلوغرافية
العنوان: |
Mitigating Solder Beading in Non-Eutectic Low-Temperature Solder: Mechanism and Solution |
المؤلفون: |
Teng, Saw Lip, Devarajan, Mutharasu, Nadarajah, Puurnaraj A-L, Yang Soo, Chye |
المصدر: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1131-1136 May, 2024 |
Relation: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
قاعدة البيانات: |
IEEE Xplore Digital Library |