مؤتمر
Mitigating Solder Beading in Non-Eutectic Low-Temperature Solder: Mechanism and Solution
| العنوان: | Mitigating Solder Beading in Non-Eutectic Low-Temperature Solder: Mechanism and Solution |
|---|---|
| المؤلفون: | Teng, Saw Lip, Devarajan, Mutharasu, Nadarajah, Puurnaraj A-L, Yang Soo, Chye |
| المصدر: | 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1131-1136 May, 2024 |
| Relation: | 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder كن أول من يترك تعليقا!