التفاصيل البيبلوغرافية
العنوان: |
Correlation of Mechanical and Microstructural Evolutions in Lead Free Solders Subjected to Various Thermal Exposures |
المؤلفون: |
Al Ahsan, Mohammad, Hasan, S M Kamrul, Chakraborty, Souvik, Suhling, Jeffrey C., Lall, Pradeep |
المصدر: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1460-1467 May, 2024 |
Relation: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
قاعدة البيانات: |
IEEE Xplore Digital Library |