التفاصيل البيبلوغرافية
العنوان: |
Modeling and Analysis of Heterogeneously Integrated Chiplet-to-Chiplet Communication Link in 2.5D Advanced Packaging |
المؤلفون: |
Sun, Haofeng, Shi, Bobi, Nguyen, Thong, Schutt-Aine, Jose E. |
المصدر: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1078-1084 May, 2024 |
Relation: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
قاعدة البيانات: |
IEEE Xplore Digital Library |