مؤتمر
Modeling and Analysis of Heterogeneously Integrated Chiplet-to-Chiplet Communication Link in 2.5D Advanced Packaging
| العنوان: | Modeling and Analysis of Heterogeneously Integrated Chiplet-to-Chiplet Communication Link in 2.5D Advanced Packaging |
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| المؤلفون: | Sun, Haofeng, Shi, Bobi, Nguyen, Thong, Schutt-Aine, Jose E. |
| المصدر: | 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1078-1084 May, 2024 |
| Relation: | 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
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