التفاصيل البيبلوغرافية
| العنوان: |
Preparation of SAC305 Solder Specimens that mimic the Microstructures of a Micro Solder Ball |
| المؤلفون: |
Kim, You-Gwon, Kim, Heon-Su, Kim, Tae-Wan, Ryu, Seoung-Ung, Kim, Hak-Sung, Jang, Yong-Rae, Han, Bongtae, Lee, Jun-Hyeong, Kim, Jin-Kyu |
| المصدر: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2261-2266 May, 2024 |
| Relation: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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