Low Thermal Budget Fine-pitch Cu/Dielectric Hybrid Bonding with Cu Microstructure Modifications

التفاصيل البيبلوغرافية
العنوان:	Low Thermal Budget Fine-pitch Cu/Dielectric Hybrid Bonding with Cu Microstructure Modifications
المؤلفون:	Cheemalamarri, Hemanth Kumar, Van Nhat Anh, Tran, Guan, Chen Gim, Lim, Meng Keong, Vempati, Srinivasa Rao, Singh, Navab
المصدر:	2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1880-1884 May, 2024
Relation:	2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
قاعدة البيانات:	IEEE Xplore Digital Library