التفاصيل البيبلوغرافية
| العنوان: |
A CMP Process for Hybrid Bonding Application with Conventional / nt-Cu and SixNy / SixOy Dielectrics |
| المؤلفون: |
Widodo, T. S., Brun, X. F., Lianto, P., Tan, A., Lie, J., Lim, P., See, G. H. |
| المصدر: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2058-2061 May, 2024 |
| Relation: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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