Collective die-to-wafer assembly process for optically interconnected System-on-wafer

التفاصيل البيبلوغرافية
العنوان:	Collective die-to-wafer assembly process for optically interconnected System-on-wafer
المؤلفون:	Kennes, Koen, Dvoretskii, Anton, Podpod, Arnita, Xu, Pengfei, He, Junwen, Lepage, Guy, Golshani, Negin, Verheyen, Peter, Magdziak, Rafal, Bipul, Swetanshu, Phommahaxay, Alain, Chakrabarti, Maumita, Miller, Andy, Beyne, Eric, Ban, Yoojin, Ferraro, Filippo, van Campenhout, Joris
المصدر:	2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1392-1397 May, 2024
Relation:	2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
قاعدة البيانات:	IEEE Xplore Digital Library