Non-TCB Process Cu/SiO2 Hybrid Bonding Using Plasma-free Hydrophilicity Enhancement with NaOH for Chip-to-wafer Bonding

التفاصيل البيبلوغرافية
العنوان:	Non-TCB Process Cu/SiO2 Hybrid Bonding Using Plasma-free Hydrophilicity Enhancement with NaOH for Chip-to-wafer Bonding
المؤلفون:	Chen, Yu-An, Ong, Jia-Juen, Chiu, Wei-Lan, Hsu, Wei-You, Yang, Shih-Chi, Chang, Hsiang-Hung, Chen, Chih
المصدر:	2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :399-403 May, 2024
Relation:	2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
قاعدة البيانات:	IEEE Xplore Digital Library