التفاصيل البيبلوغرافية
| العنوان: |
A Novel FOPLP Structure with Chip First & RDL First Process for Automotive chip application |
| المؤلفون: |
Wang, Terry, Lu, Chih Wei, Feng, Eric, Yang, Yu-Jhen, Chang, Cheng-Yueh, Cheng, Pei-Pei, Lie, Fredrick, Cheng, Austin, Huang, Hsin-Yi, Koh, Meiten, Wiatrowska, Aneta, Witczak, Lukasz |
| المصدر: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1868-1871 May, 2024 |
| Relation: |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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