التفاصيل البيبلوغرافية
| العنوان: |
Three-dimensional Thermal Modeling Method of Power Device Chip Based on Intelligent Algorithm |
| المؤلفون: |
Liu, Yi, Yuan, Shuoxun, Zhang, Jin, Zhang, Zhewei, Zhang, Lei, Gong, Hongzhou, Wang, Laili, Gao, Kai |
| المصدر: |
2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia) Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia), 2024 IEEE 10th International. :1625-1628 May, 2024 |
| Relation: |
2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
