Optimization of Design Parameters Using Taguchi Method for Thermal Stress Analysis in a 3D IC

التفاصيل البيبلوغرافية
العنوان: Optimization of Design Parameters Using Taguchi Method for Thermal Stress Analysis in a 3D IC
المؤلفون: Sazali, Syamil Bin, Hassan, Hasliza Binti, Yusof, Norliana, Husaini, Yusnira, Aziz, Anees Binti Abdul, Yaakub, Tuan Norjihan Binti Tuan
المصدر: 2024 IEEE 14th Symposium on Computer Applications & Industrial Electronics (ISCAIE) Computer Applications & Industrial Electronics (ISCAIE), 2024 IEEE 14th Symposium on. :1-4 May, 2024
Relation: 2024 IEEE 14th Symposium on Computer Applications & Industrial Electronics (ISCAIE)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9798350348798
تدمد:28364317
DOI:10.1109/ISCAIE61308.2024.10576559