Field Plate Engineering for Free Metal Routing over Lateral HV Devices

التفاصيل البيبلوغرافية
العنوان: Field Plate Engineering for Free Metal Routing over Lateral HV Devices
المؤلفون: Helke, Alexander
المصدر: 2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD) Power Semiconductor Devices and ICs (ISPSD), 2024 36th International Symposium on. :450-453 Jun, 2024
Relation: 2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9798350394825
تدمد:19460201
DOI:10.1109/ISPSD59661.2024.10579611