Gate Oxide Failure Mechanisms of SiC MOSFET Related to Electro-Thermomechanical Stress Under HTRB and HTGB Test

التفاصيل البيبلوغرافية
العنوان: Gate Oxide Failure Mechanisms of SiC MOSFET Related to Electro-Thermomechanical Stress Under HTRB and HTGB Test
المؤلفون: Ren, Min, Liang, Shiqi, Zhou, Tong, Gu, Hang, Gao, Wei, Pi, Meng, Tang, Yuting, Liu, Zhihai, Li, Zehong, Guo, Xinkai, Dai, Maozhou, Zhang, Bo
المصدر: 2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD) Power Semiconductor Devices and ICs (ISPSD), 2024 36th International Symposium on. :208-211 Jun, 2024
Relation: 2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9798350394825
تدمد:19460201
DOI:10.1109/ISPSD59661.2024.10579620