مؤتمر
Biodegradable and Water-Soluble DEG1 Substrate for Printed Circuit Board Applications
| العنوان: | Biodegradable and Water-Soluble DEG1 Substrate for Printed Circuit Board Applications |
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| المؤلفون: | Istvan, Hajdu, Amir, Hamadeh, Tamas, Lajter Peter, Attila, Geczy |
| المصدر: | 2024 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) Microelectronics Packaging (NordPac), 2024 IMAPS Nordic Conference on. :1-5 Jun, 2024 |
| Relation: | 2024 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9789189896932 |
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| DOI: | 10.23919/NordPac61094.2024.10582266 |