Simulation Study of the Temperature Field of a Flexible PCB

التفاصيل البيبلوغرافية
العنوان: Simulation Study of the Temperature Field of a Flexible PCB
المؤلفون: Evstatiev, B. I., Evstatieva, N. L.
المصدر: 2024 9th International Conference on Energy Efficiency and Agricultural Engineering (EE&AE) Energy Efficiency and Agricultural Engineering (EE&AE), 2024 9th International Conference on. :1-5 Jun, 2024
Relation: 2024 9th International Conference on Energy Efficiency and Agricultural Engineering (EE&AE)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9798350369380
9798350369373
DOI:10.1109/EEAE60309.2024.10600564