مؤتمر
Simulation Study of the Temperature Field of a Flexible PCB
العنوان: | Simulation Study of the Temperature Field of a Flexible PCB |
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المؤلفون: | Evstatiev, B. I., Evstatieva, N. L. |
المصدر: | 2024 9th International Conference on Energy Efficiency and Agricultural Engineering (EE&AE) Energy Efficiency and Agricultural Engineering (EE&AE), 2024 9th International Conference on. :1-5 Jun, 2024 |
Relation: | 2024 9th International Conference on Energy Efficiency and Agricultural Engineering (EE&AE) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9798350369380 9798350369373 |
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DOI: | 10.1109/EEAE60309.2024.10600564 |