التفاصيل البيبلوغرافية
العنوان: |
The use of bending experiments for the efficient characterization of the mechanical functionality of component interconnections |
المؤلفون: |
Wiss, Erik, Anthati, Shiva Goud, Serea, Vlad, Wiese, Steffen |
المصدر: |
2024 47th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2024 47th International Spring Seminar on. 2024:1-4 May, 2024 |
Relation: |
2024 47th International Spring Seminar on Electronics Technology (ISSE) |
قاعدة البيانات: |
IEEE Xplore Digital Library |