The use of bending experiments for the efficient characterization of the mechanical functionality of component interconnections

التفاصيل البيبلوغرافية
العنوان: The use of bending experiments for the efficient characterization of the mechanical functionality of component interconnections
المؤلفون: Wiss, Erik, Anthati, Shiva Goud, Serea, Vlad, Wiese, Steffen
المصدر: 2024 47th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2024 47th International Spring Seminar on. 2024:1-4 May, 2024
Relation: 2024 47th International Spring Seminar on Electronics Technology (ISSE)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9798350385472
تدمد:21612536
DOI:10.1109/ISSE61612.2024.10603886