مؤتمر
Low Temperature Adhesive Die Bonding for Sensitive MEMS Dies
| العنوان: | Low Temperature Adhesive Die Bonding for Sensitive MEMS Dies |
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| المؤلفون: | Beena, Nithin Anujan, Lorenz, Lukas, Ludewig, Thomas, Swiecinski, Kai, Bock, Volker |
| المصدر: | 2024 47th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2024 47th International Spring Seminar on. 2024:1-9 May, 2024 |
| Relation: | 2024 47th International Spring Seminar on Electronics Technology (ISSE) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9798350385472 |
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| تدمد: | 21612536 |
| DOI: | 10.1109/ISSE61612.2024.10603986 |