مؤتمر
Study on Compact Thermal Model for 3D Interlayer Electronic Cooling Based on Fluid-Solid Coupling Heat Transfer
| العنوان: | Study on Compact Thermal Model for 3D Interlayer Electronic Cooling Based on Fluid-Solid Coupling Heat Transfer |
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| المؤلفون: | Cao, Zhizhu, Tao, Jun, Xu, Run, Li, Jiming, Chen, Yu |
| المصدر: | 2024 2nd International Symposium of Electronics Design Automation (ISEDA) Electronics Design Automation (ISEDA), 2024 2nd International Symposium of. :600-604 May, 2024 |
| Relation: | 2024 2nd International Symposium of Electronics Design Automation (ISEDA) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9798350352030 9798350352023 |
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| DOI: | 10.1109/ISEDA62518.2024.10617672 |