Study on Compact Thermal Model for 3D Interlayer Electronic Cooling Based on Fluid-Solid Coupling Heat Transfer

التفاصيل البيبلوغرافية
العنوان: Study on Compact Thermal Model for 3D Interlayer Electronic Cooling Based on Fluid-Solid Coupling Heat Transfer
المؤلفون: Cao, Zhizhu, Tao, Jun, Xu, Run, Li, Jiming, Chen, Yu
المصدر: 2024 2nd International Symposium of Electronics Design Automation (ISEDA) Electronics Design Automation (ISEDA), 2024 2nd International Symposium of. :600-604 May, 2024
Relation: 2024 2nd International Symposium of Electronics Design Automation (ISEDA)
قاعدة البيانات: IEEE Xplore Digital Library