مؤتمر
Photonic Chiplet Integration on Optical Interposer: Can Hybrid Bonding Realize Passive Optical Coupling?
| العنوان: | Photonic Chiplet Integration on Optical Interposer: Can Hybrid Bonding Realize Passive Optical Coupling? |
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| المؤلفون: | Hwang, How Yuan, O'Brien, Peter |
| المصدر: | 2024 Photonics & Electromagnetics Research Symposium (PIERS) Photonics & Electromagnetics Research Symposium (PIERS), 2024. :1-7 Apr, 2024 |
| Relation: | 2024 Photonics & Electromagnetics Research Symposium (PIERS) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9798350375909 |
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| تدمد: | 28315804 |
| DOI: | 10.1109/PIERS62282.2024.10618259 |