التفاصيل البيبلوغرافية
| العنوان: |
Study on Curing Kinetics and Toughening Modification of Epoxy Resin System for Solder Resist |
| المؤلفون: |
Li, Liyuan, Li, Jinhui, Lv, Xialei, Sun, Rong, Zhang, Guoping |
| المصدر: |
2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-4 Aug, 2024 |
| Relation: |
2024 25th International Conference on Electronic Packaging Technology (ICEPT) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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