التفاصيل البيبلوغرافية
| العنوان: |
Study on Opto-Mechatronic Hybrid Integration Technology Based on 2.5D Advanced Packaging |
| المؤلفون: |
Yan, Congying, Ruan, Yong, Teng, Jiao, Wu, Yu, Zhou, Yuankai, Hou, Fulei, Hou, Wenjun |
| المصدر: |
2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-4 Aug, 2024 |
| Relation: |
2024 25th International Conference on Electronic Packaging Technology (ICEPT) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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