التفاصيل البيبلوغرافية
| العنوان: |
The Influence of Chip Aspect Ratios on the Crack Evolution in the Die-attach Layer Simulated Using the Fracture Phase Field Method |
| المؤلفون: |
Qin, Jiaolong, Wu, Fengshun, Li, Kewei, Ding, Liguo, Xia, Jiale, Xiang, Yuan |
| المصدر: |
2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-6 Aug, 2024 |
| Relation: |
2024 25th International Conference on Electronic Packaging Technology (ICEPT) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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