دورية أكاديمية
Thin Film Hybrid Integrated Circuits for Communication Systems
| العنوان: | Thin Film Hybrid Integrated Circuits for Communication Systems |
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| المؤلفون: | Orr, W., Robillard, T. |
| المصدر: | IEEE Transactions on Parts, Hybrids, and Packaging IEEE Trans. Parts, Hybrids, Packag. Parts, Hybrids, and Packaging, IEEE Transactions on. 8(2):51-58 Jun, 1972 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 03611000 15582469 |
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| DOI: | 10.1109/TPHP.1972.1136560 |