مؤتمر
Mating and piercing micromechanical structures for surface bonding applications
| العنوان: | Mating and piercing micromechanical structures for surface bonding applications |
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| المؤلفون: | Han, H., Weiss, L.E., Reed, M.L. |
| المصدر: | [1991] Proceedings. IEEE Micro Electro Mechanical Systems Micro Electro Mechanical Systems, 1991, MEMS '91, Proceedings. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots. IEEE. :253-258 1991 |
| Relation: | Proceedings. IEEE Micro Electro Mechanical Systems |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0879426411 9780879426415 |
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| DOI: | 10.1109/MEMSYS.1991.114806 |