مؤتمر
Current loadability of ICA for flip chip applications
| العنوان: | Current loadability of ICA for flip chip applications |
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| المؤلفون: | Haberland, J., Pahl, B., Schmitz, S., Kallmayer, C., Aschenbrenner, R., Reichl, H. |
| المصدر: | 4th Electronics Packaging Technology Conference, 2002. Electronics packaging technology Electronics Packaging Technology Conference, 2002. 4th. :144-149 2002 |
| Relation: | Proceedings 4th Electronics Packaging Technology Conference (EPTC 2002) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780374355 9780780374355 |
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| DOI: | 10.1109/EPTC.2002.1185657 |