مؤتمر
Drop impact test - mechanics & physics of failure
| العنوان: | Drop impact test - mechanics & physics of failure |
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| المؤلفون: | Wong, E.H., Lim, K.M., Lee, N., Seah, S., Hoe, C., Wang, J. |
| المصدر: | 4th Electronics Packaging Technology Conference, 2002. Electronics packaging technology Electronics Packaging Technology Conference, 2002. 4th. :327-333 2002 |
| Relation: | Proceedings 4th Electronics Packaging Technology Conference (EPTC 2002) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780374355 9780780374355 |
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| DOI: | 10.1109/EPTC.2002.1185692 |