مؤتمر
Direct liquid cooling of a stacked multichip module
| العنوان: | Direct liquid cooling of a stacked multichip module |
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| المؤلفون: | Chen, X.Y., Toh, K.C., Chai, J.C., Pinjala, D. |
| المصدر: | 4th Electronics Packaging Technology Conference, 2002. Electronics packaging technology Electronics Packaging Technology Conference, 2002. 4th. :380-384 2002 |
| Relation: | Proceedings 4th Electronics Packaging Technology Conference (EPTC 2002) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780374355 9780780374355 |
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| DOI: | 10.1109/EPTC.2002.1185702 |