مؤتمر
Materials interaction between Pb-free Sn-9Zn solder and Au pad in advanced electronic packages
| العنوان: | Materials interaction between Pb-free Sn-9Zn solder and Au pad in advanced electronic packages |
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| المؤلفون: | Lin, Y.L., Tsai, J., Kao, C.R. |
| المصدر: | Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. Electronic materials and packaging Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on. :324-329 2002 |
| Relation: | Proceedings of the 4th International Symposium on Electronic Materials and Packaging |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 078037682X 9780780376823 |
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| DOI: | 10.1109/EMAP.2002.1188859 |