Leakage, breakdown, and TDDB characteristics of porous low-k silica-based interconnect dielectrics

التفاصيل البيبلوغرافية
العنوان: Leakage, breakdown, and TDDB characteristics of porous low-k silica-based interconnect dielectrics
المؤلفون: Ogawa, E.T., Jinyoung Kim, Haase, G.S., Mogul, H.C., McPherson, J.W.
المصدر: 2003 IEEE International Reliability Physics Symposium Proceedings, 2003. 41st Annual. Reliability physics symposium Reliability Physics Symposium Proceedings, 2003. 41st Annual. 2003 IEEE International. :166-172 2003
Relation: International Reliability Physics Symposium
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:0780376498
9780780376496
DOI:10.1109/RELPHY.2003.1197739