دورية أكاديمية
New techniques for the design of advanced ultrasonic transducers for wire bonding
| العنوان: | New techniques for the design of advanced ultrasonic transducers for wire bonding |
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| المؤلفون: | Parrini, L. |
| المصدر: | IEEE Transactions on Electronics Packaging Manufacturing IEEE Trans. Electron. Packag. Manufact. Electronics Packaging Manufacturing, IEEE Transactions on. 26(1):37-45 Jan, 2003 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 1521334X 15580822 |
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| DOI: | 10.1109/TEPM.2003.813001 |