مؤتمر
Fluxless flip chip technique with Sn-rich Au/Sn solder bumps
| العنوان: | Fluxless flip chip technique with Sn-rich Au/Sn solder bumps |
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| المؤلفون: | Dongwook Kim, Chin C. Lee, Sokolowski, W.M. |
| المصدر: | 53rd Electronic Components and Technology Conference, 2003. Proceedings. Electronic Components and Technology Conference, 2003. Proceedings. 53rd. :840-843 2003 |
| Relation: | 53rd Electronic Components and Technology Conference, 2003. Proceedings. |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780377915 9780780377912 |
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| تدمد: | 05695503 |
| DOI: | 10.1109/ECTC.2003.1216387 |