مؤتمر
Application of digital speckle correlation to micro-deformation measurement of a flip chip assembly
| العنوان: | Application of digital speckle correlation to micro-deformation measurement of a flip chip assembly |
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| المؤلفون: | Pang, J.H.L., Shi, X.Q., Zhang, X.R., Liu, Q.J. |
| المصدر: | 53rd Electronic Components and Technology Conference, 2003. Proceedings. Electronic Components and Technology Conference, 2003. Proceedings. 53rd. :926-932 2003 |
| Relation: | 53rd Electronic Components and Technology Conference, 2003. Proceedings. |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780377915 9780780377912 |
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| تدمد: | 05695503 |
| DOI: | 10.1109/ECTC.2003.1216401 |