مؤتمر
Advanced i-PVD barrier metal deposition technology for 90 nm Cu interconnects
| العنوان: | Advanced i-PVD barrier metal deposition technology for 90 nm Cu interconnects |
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| المؤلفون: | Park, K.-C., Kim, I.-R., Suh, B.-S., Choi, S.-M., Song, W.-S., Wee, Y.-J., Lee, S.-G., Chung, J.-S., Chung, J.-H., Hah, S.-R., Ahn, J.-H., Lee, K.-T., Kang, H.-K., Suh, K.-P. |
| المصدر: | Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) Interconnect technology Interconnect Technology Conference, 2003. Proceedings of the IEEE 2003 International. :165-167 2003 |
| Relation: | IEEE International Interconnect Technology Conference |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780377974 9780780377974 |
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| DOI: | 10.1109/IITC.2003.1219743 |