مؤتمر
STEM imaging applications in deep-sub-micron failure analysis and process characterization
العنوان: | STEM imaging applications in deep-sub-micron failure analysis and process characterization |
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المؤلفون: | Li, K., Er, E., Redkar, S. |
المصدر: | Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003 Physical and failure analysis of integrated circuits Physical and Failure Analysis of Integrated Circuits, 2003. IPFA 2003. Proceedings of the 10th International Symposium on the. :206-209 2003 |
Relation: | IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 0780377222 9780780377226 |
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DOI: | 10.1109/IPFA.2003.1222767 |