STEM imaging applications in deep-sub-micron failure analysis and process characterization

التفاصيل البيبلوغرافية
العنوان: STEM imaging applications in deep-sub-micron failure analysis and process characterization
المؤلفون: Li, K., Er, E., Redkar, S.
المصدر: Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003 Physical and failure analysis of integrated circuits Physical and Failure Analysis of Integrated Circuits, 2003. IPFA 2003. Proceedings of the 10th International Symposium on the. :206-209 2003
Relation: IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:0780377222
9780780377226
DOI:10.1109/IPFA.2003.1222767