مؤتمر
Vibration fatigue test and analysis for flip chip solder joints
| العنوان: | Vibration fatigue test and analysis for flip chip solder joints |
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| المؤلفون: | Che, F.X., Pang, H.L.J., Wong, F.L., Lim, G.H., Low, T.H. |
| المصدر: | Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) Electronics packaging technology Electronics Packaging Technology, 2003 5th Conference (EPTC 2003). :107-113 2003 |
| Relation: | Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780382056 9780780382053 |
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| DOI: | 10.1109/EPTC.2003.1271499 |