مؤتمر
Modeling and simulation of printed circuit board drop test
| العنوان: | Modeling and simulation of printed circuit board drop test |
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| المؤلفون: | Wang, Y.Q., Low, K.H., Che, F.X., Pang, H.L.J., Yeo, S.P. |
| المصدر: | Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) Electronics packaging technology Electronics Packaging Technology, 2003 5th Conference (EPTC 2003). :263-268 2003 |
| Relation: | Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780382056 9780780382053 |
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| DOI: | 10.1109/EPTC.2003.1271526 |