مؤتمر
Intermetallic growth study on lead-free solder joint under thermal cycling and isothermal aging
| العنوان: | Intermetallic growth study on lead-free solder joint under thermal cycling and isothermal aging |
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| المؤلفون: | Lim, G.H., Kwan, H.F., Shi, X.Q. |
| المصدر: | Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) Electronics packaging technology Electronics Packaging Technology, 2003 5th Conference (EPTC 2003). :578-583 2003 |
| Relation: | Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780382056 9780780382053 |
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| DOI: | 10.1109/EPTC.2003.1271587 |