مؤتمر
SPICE-compatible thermal simulation with lumped circuit modeling for thermal reliability analysis based on modeling order reduction
| العنوان: | SPICE-compatible thermal simulation with lumped circuit modeling for thermal reliability analysis based on modeling order reduction |
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| المؤلفون: | Ting-Yuan Wang, Charlie Chung-Ping Chen |
| المصدر: | International Symposium on Signals, Circuits and Systems. Proceedings, SCS 2003. (Cat. No.03EX720) Quality electronic design Quality Electronic Design, 2004. Proceedings. 5th International Symposium on. :357-362 2004 |
| Relation: | Proceedings. 5th International Symposium on Quality Electronic Design |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0769520936 9780769520933 |
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| DOI: | 10.1109/ISQED.2004.1283700 |