An improved process, metrology and methodology for shallow trench isolation etch

التفاصيل البيبلوغرافية
العنوان: An improved process, metrology and methodology for shallow trench isolation etch
المؤلفون: Baum, C., Gaddam, S.
المصدر: 2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (IEEE Cat. No.04CH37530) Advanced semiconductor manufacturing Advanced Semiconductor Manufacturing, 2004. ASMC '04. IEEE Conference and Workshop. :93-97 2004
Relation: 2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:0780383125
9780780383128
DOI:10.1109/ASMC.2004.1309543