مؤتمر
Thermal cycle reliability of stacked via structures with copper metallization and an organic low-k dielectric
| العنوان: | Thermal cycle reliability of stacked via structures with copper metallization and an organic low-k dielectric |
|---|---|
| المؤلفون: | Filippi, R.G., McGrath, J.F., Shaw, T.M., Murray, C.E., Rathore, H.S., McLaughlin, P.S., McGahay, V., Nicholson, L., Wang, P.-C., Lloyd, J.R., Lane, M., Rosenberg, R., Liu, X., Wang, Y.-Y., Landers, W., Spooner, T., Demarest, J.J., Engel, B.H., Gill, J., Goth, G., Barth, E., Biery, G., Davis, C.R., Wachnik, R.A., Goldblatt, R., Ivers, T., Swinton, A., Barile, C., Aitken, J. |
| المصدر: | 2004 IEEE International Reliability Physics Symposium. Proceedings Reliability physics Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International. :61-67 2004 |
| Relation: | 2004 IEEE International Reliability Physics Symposium. Proceedings |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 078038315X 9780780383159 |
|---|---|
| DOI: | 10.1109/RELPHY.2004.1315302 |