مؤتمر
Electromigration performance enhancement of Cu interconnects with PVD Ta cap
| العنوان: | Electromigration performance enhancement of Cu interconnects with PVD Ta cap |
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| المؤلفون: | Gajewski, D.A., Meixner, T., Feil, B., Lien, M., Walls, J. |
| المصدر: | 2004 IEEE International Reliability Physics Symposium. Proceedings Reliability physics Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International. :627-628 2004 |
| Relation: | 2004 IEEE International Reliability Physics Symposium. Proceedings |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 078038315X 9780780383159 |
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| DOI: | 10.1109/RELPHY.2004.1315422 |