مؤتمر
Integration of thermal compact models into finite element simulation of printed wiring assemblies
العنوان: | Integration of thermal compact models into finite element simulation of printed wiring assemblies |
---|---|
المؤلفون: | Haller, D., Neumaier, K., Khan, S.H., Grattan, K.T.V. |
المصدر: | Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545) Semiconductor thermal measurement and management Semiconductor Thermal Measurement and Management Symposium, 2004. Twentieth Annual IEEE. :271-277 2004 |
Relation: | Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 078038363X 9780780383630 |
---|---|
تدمد: | 10652221 |
DOI: | 10.1109/STHERM.2004.1291334 |