مؤتمر
Integration of thermal compact models into finite element simulation of printed wiring assemblies
| العنوان: | Integration of thermal compact models into finite element simulation of printed wiring assemblies |
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| المؤلفون: | Haller, D., Neumaier, K., Khan, S.H., Grattan, K.T.V. |
| المصدر: | Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545) Semiconductor thermal measurement and management Semiconductor Thermal Measurement and Management Symposium, 2004. Twentieth Annual IEEE. :271-277 2004 |
| Relation: | Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 078038363X 9780780383630 |
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| تدمد: | 10652221 |
| DOI: | 10.1109/STHERM.2004.1291334 |