مؤتمر
Correlation between power cycling and thermal cycling fatigue reliabilities of chip-scale packages
| العنوان: | Correlation between power cycling and thermal cycling fatigue reliabilities of chip-scale packages |
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| المؤلفون: | Tong Hong Wang, Chang Chi Lee, Yi-Shao Lai, Chun-En Huang |
| المصدر: | IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585) Electronics manufacturing technology Electronics Manufacturing Technology Symposium, 2004. IEEE/CPMT/SEMI 29th International. :26-30 2004 |
| Relation: | IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780385829 9780780385825 |
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| تدمد: | 10898190 |
| DOI: | 10.1109/IEMT.2004.1321627 |