مؤتمر
Correlation between power cycling and thermal cycling fatigue reliabilities of chip-scale packages
العنوان: | Correlation between power cycling and thermal cycling fatigue reliabilities of chip-scale packages |
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المؤلفون: | Tong Hong Wang, Chang Chi Lee, Yi-Shao Lai, Chun-En Huang |
المصدر: | IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585) Electronics manufacturing technology Electronics Manufacturing Technology Symposium, 2004. IEEE/CPMT/SEMI 29th International. :26-30 2004 |
Relation: | IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium |
قاعدة البيانات: | IEEE Xplore Digital Library |
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