مؤتمر
Comparison of copper interconnect electromigration behaviors in various structures for advanced BEOL technology
| العنوان: | Comparison of copper interconnect electromigration behaviors in various structures for advanced BEOL technology |
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| المؤلفون: | Lin, M.H., Lin, Y.L., Yang, G.S., Yeh, M.-S., Chang, K.P., Su, K.C., Tahui Wang |
| المصدر: | Proceedings of the 11th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2004 (IEEE Cat. No.04TH8743) Physical and failure analysis of integrated circuits Physical and Failure Analysis of Integrated Circuits, 2004. IPFA 2004. Proceedings of the 11th International Symposium on the. :177-180 2004 |
| Relation: | Proceedings of the 11th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2004 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780384547 9780780384545 |
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| DOI: | 10.1109/IPFA.2004.1345583 |