مؤتمر
300mm copper low-k integration and reliability for 90 and 65 nm nodes
| العنوان: | 300mm copper low-k integration and reliability for 90 and 65 nm nodes |
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| المؤلفون: | Parikh, S., Naik, M., Hung, R., Huixiong Dai, Padhi, D., Zhang, L., Pan, T., Kuo-Wei Liu, Dixit, G., Armacost, M. |
| المصدر: | Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) Interconnect technology Interconnect Technology Conference, 2004. Proceedings of the IEEE 2004 International. :60-62 2004 |
| Relation: | Proceedings of the IEEE 2004 International Interconnect Technology Conference |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780383087 9780780383081 |
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| DOI: | 10.1109/IITC.2004.1345684 |