مؤتمر
Effects of dielectric liners on TDDB lifetime of a Cu/ low-k interconnect
| العنوان: | Effects of dielectric liners on TDDB lifetime of a Cu/ low-k interconnect |
|---|---|
| المؤلفون: | Tsui, T.Y., Matz, P., Willecke, R., Zielinski, E., Tae Kim, Haase, G., McPherson, J., Singh, A., McKerrow, A.J. |
| المصدر: | Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) Interconnect technology Interconnect Technology Conference, 2004. Proceedings of the IEEE 2004 International. :78-80 2004 |
| Relation: | Proceedings of the IEEE 2004 International Interconnect Technology Conference |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780383087 9780780383081 |
|---|---|
| DOI: | 10.1109/IITC.2004.1345692 |